The hottest IC two wheel drive industry leaps

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Integrated circuit: the two wheel drive industry leaps

integrated circuit is a strategic, basic and leading industry. It is an important support for cultivating strategic emerging industries and developing the information economy. It has a very prominent core position in the field of information technology. Since the beginning of the 21st century, in order to promote the development of integrated circuit industry, China has successively issued GF [2000] No. 18 document and GF [2011] No. 4 document, implemented "major national science and technology projects", and issued the outline for promoting the development of national integrated circuit industry in 2014

driven by the market and policies, the strength of China's integrated circuit industry has been rapidly improved. The integrated circuit design technology in key fields such as mobile intelligent terminal, network communication and IOT has reached the international advanced level. The 28nm manufacturing process has achieved mass production on a large scale. Leading enterprises have continued to make profits. The packaging technology has kept pace with the year-on-year growth of nearly 12% in 2016, Key equipment and materials are integrated into the international procurement system

the overall situation is good, and the development of design and manufacturing is prominent.

since the 12th Five Year Plan, with the significant increase of national support for the integrated circuit industry and the intensive introduction and implementation of measures in financing, taxes and other aspects, China's IC industry has entered a stage of accelerated development. The industrial scale has increased from 218.55 billion yuan in 2012 to 433.55 billion yuan in 2016, almost doubling in five years

according to the statistics of the Ministry of industry and information technology, in 2016, China's semiconductor industry completed a fixed asset investment of 100.113 billion yuan, of which the integrated circuit industry completed a fixed asset investment of 87.957 billion yuan, a year-on-year increase of 31%. With the market pull and policy support, the strength of all links of China's integrated circuit industry has been improved as a whole, especially the design industry, which is known as the leader of the integrated circuit industry, and the wafer manufacturing, which is the foundation of the integrated circuit industry, has grown more significantly

The IC design industry has developed very rapidly in recent years. According to the data of China Semiconductor Industry Association (CSIA), the IC design industry achieved a growth rate of 24.1% in 2016, 4 percentage points higher than the National IC industry and 11.8 percentage points higher than the global design industry. The sales scale reached 164.43 billion yuan, which not only surpassed the sales revenue of 156.43 billion yuan in the mainland packaging and testing industry for the first time, but also accounted for the largest proportion in the IC industry, and exceeded the sales of the IC design industry in Taiwan

the business scale of design enterprises has increased significantly. According to the statistics of CSIA design branch, there are 161 enterprises with sales of more than 100million yuan, an increase of 18 compared with 2015, with an increase of 12.59%, accounting for 11.9% of the total number of enterprises in the industry in the same period. Among them, not only Shenzhen Hisilicon and Ziguang zhanrui, which have entered the top ten in the global IC design industry, but also a number of advantageous backbone enterprises such as Huada semiconductor, Shenzhen ZTE microelectronics and Beijing smart chip. The total number of design enterprises in China has increased from 736 in 2015 to 1362 in 2016. 626 start-ups have been born in one year, with an increase of 85.05%, making the number of IC design practitioners reach 130000

the development of wafer manufacturing industry also continued to improve. SMIC international advanced manufacturing process shipments increased, the technology of China power micro production line improved, and 8-inch production lines such as Huahong Hongli and China Resources Microelectronics operated at full capacity. In 2016, the domestic wafer manufacturing industry continued to maintain a high-speed growth trend, reaching 25.1%, with an industrial scale of 112.69 billion yuan. The growth rate was the highest among the three industries of design, manufacturing and packaging and testing, and the technical level continued to improve

the domestic packaging and testing industry also maintained a steady growth trend. In 2016, driven by the substantial increase in both domestic and overseas orders, its scale reached 156.43 billion yuan, with a year-on-year growth rate of 13%. According to the statistics of CSIA packaging and testing branch, IC packaging and testing enterprises with a certain scale in China are mainly concentrated in the Yangtze River Delta (50), the Pearl River Delta (11) and the Bohai Bay area around Beijing and Tianjin (13), accounting for 56.2%, 12.4% and 14.6% respectively. The regional advantages of the central and western regions, especially Xi'an, Wuhan and Chengdu, are also becoming increasingly prominent. The sealing and testing industry has been developing continuously, accounting for 12.4% in 2016

the strength of the continuous emergence of key enterprises has been significantly enhanced.

during the development of China's integrated circuit industry in recent years, it has not only shown a good attitude of steady progress, but also emerged a number of key enterprises with international influence

in the field of design, Shenzhen Hisilicon and Ziguang zhanrui ranked sixth and tenth among the top ten in the global IC design industry respectively; In the 2016 global top 50 IC Design rankings published by icinsights, China has entered 11 design enterprises

the entry threshold of China's top ten design enterprises has increased from 1.79 billion yuan in 2015 to 2.05 billion yuan. The total sales of China's top ten IC design enterprises reached 69.31 billion yuan, an increase of 25% over 2015, accounting for 42.15% of the total sales of the IC design industry

among them, Hisilicon semiconductor achieved sales of 30.3 billion yuan in 2016, becoming the first IC design enterprise in China with sales exceeding 30billion yuan, and continuing to rank first among domestic IC design enterprises. According to the statistics of IC design branch, the threshold for the top 50 enterprises in China is 420million yuan, with a total sales of 102.67 billion yuan, accounting for 62.4% of the industry's 164.43 billion yuan sales. Their growth shows that the energy level of China's IC design industry has undergone a qualitative change, laying a solid foundation for its entry into the world's advanced ranks in 2020

in the field of wafer manufacturing, there are also a number of enterprises with international influence. In 2016, SMIC ranked the fourth among the global OEM enterprises in terms of small growth, with sales reaching US $2.914 billion, a year-on-year increase of 30.3%. In 2016, the sales of 65nm and less processes of SMIC accounted for 44.6% of the total sales. At present, the sales of 28nm process accounts for a relatively low proportion. It is expected that the sales of 28nm process nodes will reach 7% - 9% in 2017

in 2016, the proportion of sales from Chinese customers of SMIC international increased from 47.74% in 2015 to 49.7%. In 2016, SMIC international purchased 70% of the enterprise capital of lf0unry, an Italian pure wafer foundry, for 49million euros, making the company a step towards the automotive chip market. In 2006, SMIC also announced the construction of three production lines, including the construction of a new 12 inch production line in Shanghai at a cost of 67.5 billion yuan, the launch of the 12 inch production line in Shenzhen, and the construction of the third phase project in Beijing. It also used US $1.5 billion to expand the 8-inch production line in Tianjin and planned to build an 8-inch project in Ningbo, Zhejiang

Shanghai Huahong Hongli ranks eighth among global OEM enterprises. In 2016, the company successfully completed the annual production expansion task, with a total monthly production capacity of 155000 8-inch silicon wafers, and a record sales revenue of $721.4 million, an increase of 11.0% year-on-year due to humidity; Net profit increased by 14.5% to US $128.8 million, maintaining 24 consecutive quarters of profit. The bank card security chip jointly developed and produced by the company and its customers has successively obtained the international emvco chip security certification, cceal5+ certification and MasterCard CQM certification. The company has become one of the top ten enterprises authorized for invention patents of IC enterprises in China

the 55nm image sensor process developed by Shanghai Huali microelectronics, which is also part of Shanghai Huahong group, is the most advanced image sensor process platform in China. It is also the only one in China that uses the 12 inch 55nm process node to manufacture high-end image sensor chips, and is the first to enter the large-scale mass production wafer foundry. Driven by the smart market growth, which has tested the product's apparent density, compression strength, thermal insulation performance, zigzag fracture force, combustion performance and other items, and benefited from the market demand for dual lenses, the shipment of Huali micro's image processor chips has continued to grow steadily

Huali micro also provides an industry compatible process platform for 6V medium voltage devices and 32V high voltage devices, which has the advantages of low cost and low power consumption. The 12 inch advanced process production line with a total investment of 38.7 billion yuan was officially started in december2016. The project is a secondary upgrading project of the "909 project". After the completion of the project, a 12 inch chip production line with a monthly capacity of 40000 chips will be built, and the process technology covers 28nm-14nm

in the packaging and testing industry, with the acquisition and integration of Singapore Xingke Jinpeng by Jiangsu Xinchao Technology Group Co., Ltd. and AMD packaging and testing business by Nantong Huada microelectronics Group Co., Ltd., the sales scale of these two packaging and testing enterprises in China has crossed the 10billion yuan mark for the first time. Tianshui Huatian has also significantly improved its service capability and competitiveness in the field of high-end packaging and testing through the acquisition of American FC engineering company. These three companies also entered the list of the world's top ten sealing and testing enterprises, ranking third, seventh and eighth respectively

innovative technology highlights frequently, reaching the advanced level

with the support of major national science and technology projects, the overall technical level of China's integrated circuit industry has significantly improved since the "12th Five Year Plan". In the field of design, 16nm products have been successfully commercialized, and have initially reversed the dominance in the field of communication chips. Chips in the fields of computers, smart cards, multimedia and consumer electronics have developed rapidly; Wafer manufacturing broke through the 28nm process node, and leading enterprises continued to make profits; Packaging and testing enterprises are among the first echelons in the world

in the research and development of medium and high-end intelligent chips, Shenzhen Hisilicon and Ziguang zhanrui have fully entered the global mainstream design level of 16/14nm, and the chip performance has reached the international advanced level. Shanghai megacore zx-c processor, which adopts 28nm process and has a dominant frequency of 2.0GHz, has passed the national CCC certification, and has been promoted and applied in national key systems and projects. It was awarded the gold medal at the 18th China International Industrial Expo in 2016

Guoke microelectronics has made good achievements in the field of satellite TV and security monitoring in recent years, and has begun to deploy WiFi and GPS products, as well as solid-state memory controllers with more promising market prospects. Huada Jiutian's timing convergence tool has been recognized by more than 20 10nm process film design companies around the world, and is currently cooperating with the world's most advanced foundry to develop 7Nm timing convergence products

in the Cambrian, the first deep learning dedicated processor chip (NPU) in the world has been developed. At present, it has been authorized to be integrated into terminal chips such as, security and wearable devices. Hangzhou Zhongtian's CK series embedded microprocessors have shipped more than 450million PCs in domestic printers, monitors, financial smart cards and other fields, and nearly 200million PCs for single product applications, with a steady increase in market share

the "Shenwei Taihu light" with all domestic CPUs has become the world's first supercomputer with a computing speed of more than 1billion times/s, ranking first among the top 500 supercomputing companies in the world

in recent years, the layout and construction of domestic IC wafer production lines have reached a climax, with unprecedented investment in wafer production lines and breakthroughs in advanced processes. In addition to breaking through the 28nm process node, the technology has been applied in mass production. SMIC has also jointly developed the 14nm advanced manufacturing process with a joint venture formed by Huawei, Qualcomm and IMEC in Belgium

the National IC industry investment fund, Ziguang group and Wuhan city jointly invested in the construction of "Yangtze River storage", entered the memory industry project and made great progress; The construction of 12 inch projects such as Shanghai Huali micro phase II, Jinjiang Jinhua memory project, SMIC Beijing B3, SMIC Shanghai and SMIC Shenzhen has also started; In the next few years, the production capacity of domestic L2 inch production line will grow rapidly

the proportion of medium and high-end products in the sealing and testing field represents the development level of the sealing and testing industry in a country or region. According to incomplete statistics of the packaging and testing branch, at present, domestic packaging and testing enterprises are in BGA, CSP, wlp/wlcsp, fcbga/fccsp, B

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